Radiator specificationToday we know about main technical indicators of heat sink. These indicators help us to the radiator has a better understanding, but also our strong basis of the future when choosing a radiator. Fan diameter
ventilation area of the fan, this is a very important indicator, which is related to the exhaust fan. Fan diameter, the greater, the greater the exhaust fan and wind effects of larger surfaces. It is worth mentioning that, when we use Micro-plate Board, must pay attention to the diameter of the fan will not be too large, so as to avoid situations cannot be installed.
★ fan speed
This is an important index to measure fan capacity. In General, the same size fan, high speed, air flow is greater, CPU cooling obtained the better.
fan speed fan and power are inextricably linked. High power, the fan speed is faster, transfer, the greater the air input to the CPU. But the noise will also increase, so balanced, speed control in 4000rpm.
★ fan volumetric flow, refers to the flow of the air volume per unit of time, which is, of course, the bigger the better. In General, the fan size and speed, it will increase its volume.
measuring the size of a fan exhaust is very easy, just put his hand on the heatsink near feeling the strength of the wind blowing out, usually good quality fan, even if we are far away from it, can be romantic, this is good heat dissipation performance.
★ heatsink material
currently in the processor cooling areas, heat sink materials include copper, aluminum in two ways. First is aluminum radiators on the market, and in a long period of relatively commonplace. The reason is that aluminum and low price, good ductility, easy to mold. But the disadvantage is the low thermal conductivity, and therefore unable to adapt to the current trend in CPU heat output increases. The other hand, use copper in your high end heatsinks product material, such as Tt's recently launched the Mars 5. Under the same conditions, copper of aluminium in conduction of heat per unit time is nearly twice as much. Therefore, copper for high-end heat sink material of choice. But not only expensive, easily oxidized copper and aluminum compared to extrusion, process requirements more stringent. Therefore, a copper heat sink the cost is much higher than the aluminum heat sink, that high definition brings high prices.
for the above reasons, in order to find the best combination of cost and thermal effect, copper, aluminum and their physical advantage. Currently, high-end products, widely used combination of copper and aluminum heat sink technology--that is, copper bottom insert technology. It is understood that this technology was first put forward by the world famous Tt radiator manufacturers, and first in its related products. Copper thermal conductivity characteristics, combined with the advantage of portability, easy extrusion of aluminum. Through copper CPU heat circulated by "core" passed to the aluminum fins, and fan convection emitted into the air, completed this critical heat conduction. Heatsink size
radiator is divided into the fan and heat sink two parts, heat sinks are made up of cooling fins and the base. Larger heat sink, and it absorbs more heat transfer, thermal efficiency is higher. But from space (arranged for other components on the motherboard) and cost constraints, the radiator volume reaches a certain level, it will be difficult to continue to increase. In order to continue to enhance the heat sink cooling effect and had to shape and quantity of cooling fins to work on. This makes manufacturers on the heat sink manufacturing the guise, leads to a road "spectacular" scene. When you see a radiator cooling fins is very complex and when numerous, so don't think this is just for decoration, this is in fact a manifestation of high cooling capacity. ★
heat sink bottom is uneven heat sinks Machining accuracy reduces the contact area with the CPU, reducing heat transfer performance. For CPU operation gives off heat to get a steady flow of transfer, Intel and AMD CPU products supporting the evenness of heat sink have strict requirements, at present, only a few – such as Tt, the strength of the first radiator manufacturer in order to constantly develop new products through Intel and AMD's certification.
★ fan bearing
is radiator fan bearing the "heart". At present, more common is oil bearings, ball bearings, ball bearings, single and double. Oil bearing
used in low-end products, made of porous metallic material can absorb and conserve oil, reduce the wear. The process is low cost, fan life is only about 10,000 hours. With the fallout and volatility of oil, bearing noise will increase fan speed slows down. Single ball bearing composed by ball bearings and Oilless bearings. This technology mature, coaxial challenge is to ensure that the two bearings. Fan life expectancy increased to 40,000 hours. Due to its better noise control and heat dissipation efficiency, these bearings are always radiator market dominance. Since then, the double ball bearing and the product life of up to 60,000 hours. With ball bearings and the run-in, beginning when a considerable amount of noise will gradually reduce, shows its excellent thermal performance. Clip
buckle for fixing a radiator, force will damage the CPU. Current clip according to the Intel Socket 478 architecture AMD Socket 462 architecture designed by, which in turn can be divided into single-hole, three-hole clip two. P4 surface covered by a wear-resistant materials, and equipped with heat sinks on the motherboard supports, fasteners do not ask. And the Athlon XP Clip is to bear the entire thermal weight, in particular the pursuit of super pure copper heatsink cooling effect, had to use a more balanced three-buckle, which is what AMD recommends clip design. And three-hole clip fit the higher force balance can avoid excessive pressure Socket socket fracture as a result of this fastener installation is simple. Nowadays only a few quality radiator design, such as Tt volcano 9 generations.